Abstract
Nowadays, micro–nanomanufacturing technology and micro–nanodevices have seen some development, but many micro–nanodevices and microelectromechanical systems have not been practically used as products. This is because dispensing technology used in micro–nanosize encapsulation and assembly is one of the main obstacles, such as the size of the glue point, the amount of glue, and precision. In this paper, on the basis of the principle of transfer printing, an ultra-microautomatic dispenser method of pL-fL grade pipetting needle glue transfer type is proposed. This method involves controlling the pipetting needle pass through the capillary tube filled with glue liquid by the precision micro-displacement drive platform, making the terminal of the pipetting needle attach to a trace amount of adhesive, and then leaving a part of the glue liquid on the base plane to form tiny glue points using the adhesive force of glue liquid in contact with the base plane and the pulling force of the drive platform on glue liquid. The diameter of the glue point is about dozens of microns, and the amount of glue is pL of magnitude. In this paper, the dispensing process was simulated under different parameters, and the main factors affecting the dispensing process were preliminarily determined. The influence law of the diameter of the pipetting needle, movement speed, and residence time on the diameter of the glue point was analyzed by orthogonal experiment. On the basis of the influencing factors and laws obtained above, the automatic distribution of fL grade glue liquid was realized through a reasonable configuration of parameters. The minimum diameter of the glue point was 13.2 µm, and the volume was 26.3 fL.
Highlights
With the development of engineering technology in the direction of integration, intelligence, and diversification, today’s highprecision engineering technology has gradually formed two development trends: One trend is toward the systems engineering field on a super large scale, such as manned spaceflight, aircraft carriers, and big planes; another trend is to develop toward the field of ultra-high-precision micro-engineering, such as nanoscale microrobots, micro-assembly technology, and microelectronic packaging technology.1 Microelectronics packaging technology is an important part in the field of micro-engineering, and one of its key technologies is dispensing technology
The ultra-micro-dispensing method proposed in this paper involves controlling the pipetting needle to pass through the capillary tube filled with glue liquid, making the glue liquid adsorb to the surface of the pipetting needle, continuing to move downward until the glue is in contact with the base plane, and leaving a part of the glue liquid on the base plane by the combined action of the force between the glue and the base surface and the reverse pulling force exerted by the pipetting needle on glue liquid
At these four movement speeds, the diameters of glue points formed are 123, 146, 164, and 175 μm, respectively. It can be seen from the simulation results that the diameter of the glue point increases with the increase in the movement speed, and it can be preliminarily determined that the change in the scitation.org/journal/adv movement speed of the pipetting needle directly affects the diameter of the glue point
Summary
With the development of engineering technology in the direction of integration, intelligence, and diversification, today’s highprecision engineering technology has gradually formed two development trends: One trend is toward the systems engineering field on a super large scale, such as manned spaceflight, aircraft carriers, and big planes; another trend is to develop toward the field of ultra-high-precision micro-engineering, such as nanoscale microrobots, micro-assembly technology, and microelectronic packaging technology. Microelectronics packaging technology is an important part in the field of micro-engineering, and one of its key technologies is dispensing technology. Specific problems include control system delay, vibration, the effect of temperature change on the viscosity of the glue, inconvenient adjustment of the device, glue leakage, the large diameter of the glue point, and the low viscosity of the glue In view of these problems, most dispensing methods cannot solve these problems at the same time and there is no way to achieve the fL level dispensing. An ultra-microprecise dispensing method based on the surface tension of the glue drops was proposed; this method is involves the complete transfer of the glue liquid through the pipetting needle This dispensing method can solve most existing technical issues; its characteristics are as follows: convenient installation and adjustment, no delay in the control system, good sealing, a wide range of applicable glue liquids, achieving fL grade glue automatic continuous distribution, fully applicable microelectronics encapsulation field, and cost-effectiveness. The key point of this paper is to study the influencing factors and the role of the parameter configuration of the method and realize the control of the amount of glue by adjusting the parameters
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