Abstract
The blind via holes formation by laser drilling is one of the key technologies for demanding high density interconnect printed circuit boards. In this paper , the drilling conditions of drilling the blind via holes and the quality of the drilled holes are examined using a CO2 laser source against the FR4 board without copper foil.We chose laser energy,pulse shot,pulse width and diameter of beam as the experimental parameter . The results showed that laser energy and beam diameter played a more important role on changing the blind vias’ diameter than pulse shot and pulse width .While the pulse shot and pulse width take more important role in changing the depth of vias.
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