Abstract
This paper reports our progress in developing parallel coupled-line filters based on Si-based VLSI backend interconnects for millimeter-wave applications. The resonant frequency of this coupled-line filter increases with increasing spacing-gap and with increasing IDM thickness. By using high resistivity substrate, the parallel coupled-line band-pass filter is extremely effective in reducing substrate loss, and also provides very low insertion loss, even at the millimeter-wave regime. In addition, the parallel coupled-line filter suitable for advanced system-on-a-chips at the millimeter wave application achieves high performance characteristics, which show low insertion loss, wide band, and compatibility with standard VLSI process.
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