Abstract
This article provides numerically study of the thermal performance of a microchannel, cooled with either pure water or a Cu-water nanofluid, while considering the effects of both slip and no-slip boundary conditions on the flow field and heat transfer. The microchannel is partially heated at a constant temperature and cooled by forced convection of a laminar flow at a relatively lower temperature. The effects of pertinent parameters such as Reynolds number, solid volume fraction, and slip velocity coefficient on the thermal performance of the microchannel are studied. The results of the numerical simulation indicate that the heat transfer rate is significantly affected by the solid volume fraction and slip velocity coefficient at high Reynolds numbers.
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