A Novel Through Mold Plate (TMP) for Signal and Thermal Integrity Improvement of High Bandwidth Memory (HBM)

Abstract

In this paper, we firstly proposed and electrical and thermal co-analyzed a novel through mold plate (TMP) for thermal management of high bandwidth memory (HBM). Thermal issues are bottlenecks in the development of HBM and 2.5-D/3-D ICs. The proposed TMP can be one of the promising solutions for advanced thermal management. Thermal coupling from the graphic processing unit (GPU) is the dominant factor for HBM thermal issues. A new thermal path can be achieved by installing the TMP in the epoxy molding compound (EMC) between GPU and HBM to significantly prevent thermal coupling from the GPU. By using 3D electromagnetic and fluent simulation, we verified the proposed TMP based on co-analysis of signal integrity (SI) and thermal integrity (TI). SI analysis considering both TMP and operating temperature provided the thermal and electrical superiority of TMP. As a result, the results showed the improvement of thermal integrity and signal integrity of the HBM by not only reducing HBM junction temperature by 10.3 °C but also decreasing jitter by 4.54 % compared to a conventional HBM graphic module.