A novel technique for stir soldering of aluminum plate to aluminum foam

Abstract

This paper introduces a novel soldering method for joining aluminum foams to aluminum plates. This method uses zinc-based solder material to a rotating aluminum plate to join the aluminum foam. Rotation of the aluminum plate over the solder material drags the solder material, stirring it during the soldering process, and helps the wetting in plate-solder-foam interfaces. The mechanical properties of the joint were investigated. Excellent tensile strength was obtained compared to those samples that were welded with the soldering flux but with no rotation involved. Tensile strength was nearly 100% higher when stirring was used. The method is introduced as flux-less stir soldering (FSS). Scanning electron microscope examinations showed diffusion had occurred between the solder alloy with aluminum foam and the aluminum plate.