Abstract
In the split Hopkinson pressure bar (SHPB) experiment, the quality of the strain gauge directly influences the accuracy of measurement. At present, strain gauge paste depends entirely on manual work during the SHPB test. Under the same conditions of glue and environment, the paste quality relies on individual proficiency. Due to various uncertainties in manual pasting, the pasting position may be inaccurate, causing uneven stress in the strain gauges and affecting the final measurement. In order to obtain the desired experimental results, it is sometimes necessary to repeatedly attach the strain gauges, a process that not only wastes strain gauges, but also delays experiment progress. In this design, we use ANSYS simulation technology to analyze pressure in the paste bonding process, obtaining a more suitable pressure. Taking the semiconductor strain gauge as the object of study, we investigate the effect of paste pressure on the strain gauge's working accuracy. Based on the experimental data, a device for automatically attaching strain gauges is designed in order to complete the strain gauges' paste work in a mechanized manner. This design allows control over errors caused by manual operation, greatly improves repetition precision and reduces the adverse effects of human factors on experimental results.
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