Abstract
This research uses innovative approaches for characteriz- ing spring probes, a flnal-test bottleneck applied to microwave pack- aging. The modeling method depends on conventional microwave on- wafer measurement. This paper compares the novel microwave 3D di- rect calibration and measurement to observe the issues of spring probe reliability. We makes the key component of a novel approach to 3D calibration and measurement, the double-sided thru calibration ele- ment with delay time delivers from 3D EM simulation. The current study compares the modeling method and 3D direct measurement to prove the capability of the latter and presents the reliability about compressing distance of spring probes.
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