Abstract
This paper presents a simple yet novel analytical approach to model the heat conduction in a Printed Circuit Board (PCB) by taking advantage of the large thermal conductivity contrast between the copper and glass-epoxy layers. The model provides a compact expression for the effective thermal resistance of a PCB and captures an approximate 2-dimensional temperature distribution within the PCB copper layer using simple one-dimensional fin equations in successive copper-glass epoxy layers. The results for effective thermal resistance and temperature distributions in copper layers agree within ±10% of those predicted using finite element (FEM) simulations. The present approach can significantly improve the system level thermal modeling and design of single and multi-component PCBs.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
