Abstract
The design, finite element modeling, fabrication, and characterization of a novel surface acoustic wave (SAW) delay line for bio/chemical and telecommunication applications in CMOS technology are introduced. A full modeling was carried out. The devices are designed in a standard semiconductor foundry 1.5-mum two-metal two-poly process. A unique maskless postprocessing sequence is designed and completed. The three postprocessing steps are fully compatible with any standard integrated circuit technology such as CMOS. This allows any signal control/processing circuitry to be easily integrated on the same chip. ZnO is used as the piezoelectric material for SAW generation. A thorough characterization and patterning optimization of the sputtered ZnO was carried out. The major novelties that are introduced in the SAW delay line features are the embedded heater elements for temperature control, compensation, and acoustic absorbers that are designed to eliminate edge reflections and minimize triple transit interference that is amplified by edge reflections. Both of these attributes are designed by using CMOS materials without disturbing SAW performance
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
