Abstract

In the present work, we have invented and demonstrated a novel process for fabricating perfect convex corners for MEMS structures using bulk micromachining technology. The technique is developed using well-established IC processes. The process does not require any corner compensating structure and photolithography steps after anisotropic etching for realization of convex corners as reported in the literature. In this work, perfect convex corners have been realized using two-step anisotropic etching and local oxidation of silicon (LOCOS) processes. Microstructures having convex corners were fabricated using this process. The resulting structures exhibit total symmetry and perfect convex corners with square/rectangular-shaped top and bottom planes.

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