Abstract
In a conventional electrically conductive adhesive (ECA) preparation process, typical ECAs are made by adding an appropriate amount of electrically conductive fillers, such as silver, into a polymer matrix, such as epoxy resin, to form a uniformly dispersed mixture by mixing and stirring operations. However, during the preparation process, secondary pollution and mass loss are caused by the vigorous mixture process. At the same time, the stirring operation introduces many small and stable bubbles, which affect the electrical conductivity of the ECAs. In light of these problems with the conventional preparation of ECAs, we developed a novel ECA preparation method that employs a powder spraying process: silver flakes are sprayed into the epoxy resin with a certain mass fraction to form formulated pastes. The as-prepared ECAs exhibited excellent properties compared with those prepared by the conventional process. This proves that the powder spraying process is feasible and superior to the conventional process.
Highlights
The interconnected technology of electronics and photovoltaic manufacturing has been dominated by tin–lead alloy solders since the very beginning [1,2,3]
As the mass fraction of Ag flakes grew to 40 wt %, the electrically conductive adhesive (ECA) fabricated by the powder spraying process exhibited a remarkable electrical resistivity of 1.9 × 10−3 Ω·cm
We developed a novel preparation method of ECAs by the powder spraying process
Summary
The interconnected technology of electronics and photovoltaic manufacturing has been dominated by tin–lead alloy solders since the very beginning [1,2,3]. Conductive adhesives (ECAs) are regarded as the most promising alternative to tin–lead alloy solders because they are more environmentally friendly than lead, easier to fabricate, and have a lower processing temperature. They can provide higher-resolution printing compared with tin–lead alloy solders [28]. Powder spraying technology, which is mostly applied in the mechanical engineering field, provides an approach to fix the powder to substrates [61] It can eliminate the vigorous mixing process of different components during processing of the target material, causing little disturbance to polymer matrix and avoiding secondary pollution and mass loss. This process results in excellent electrical conductivity and mechanical properties compared with the conventional method
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