A Novel PowderMEMS Technique for Fabrication of Low‐Cost High‐Power‐Factor Thermoelectric Films and Micro‐Patterns

Abstract

Thermoelectric (TE) films, which are normally fabricated by MicroElectroMechanical-Systems (MEMS) technology, are crucial for the development of micro-TE devices (e.g., Peltier coolers for hot-spot cooling, TE generators). However, achieving a significant TE property (e.g., high power factor) of TE films and a low-cost fabrication process is challenging. A novel fabrication technique named PowderMEMS to fabricate high-performance, low-cost TE films, and micro-patterns is presented in this article. The TE film is based on agglomeration of micro-sized N-type Bi 2 Te 2.5 Se 0.5 (BTS) powders with stoichiometric composition by the molten binder bismuth (Bi). The influence of the key process parameters (e.g., the weight ratio between the TE powder and the binder, the hot-pressing duration, and pressure) on the TE performance is investigated. The TE film exhibits a maximum power factor of 1.7 mW m − 1 K − 2 at room temperature, which is the highest value reported so far for the state-of-the-art TE thick film (thickness > 10 μm). Besides, the PowderMEMS-based TE films are successfully patterned to the micro-pillar array, which opens up a new MEMS-compatible approach for manufacturing micro-TE devices.