Abstract

In this paper, a novel device structure named as partially insulated (Pi-OX) junctionless transistor (JLT) is proposed and the simulated results below 20 nm have been compared with existing silicon-on-insulator (SOI) JLT. Further, drain-induced barrier lowering (DIBL), subthreshold swing (SS), on-state drive current (I ON ), off-state leakage current (I OFF ), I ON /I OFF ratio and static power dissipation (P STAT ) of the proposed Pi-OXJLT and SOIJLT has also been compared. It has been found that, I OFF , DIBL and SS in the case of proposed Pi-OXJLT are reduced by 57%, 17% and 10% respectively over the existing SOIJLT device. The fabrication flow of the proposed Pi-OXJLT is proposed.

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