Abstract
In this study, a novel wetness and moisture concentration analysis approach is presented. A finite element method is utilized for the solution technique mainly using thermal and surface effect elements. Numerical results obtained from the current approach are compared against other existing finite element-based solutions and the newly introduced peridynamics theory. For numerical analysis, a reflow soldering stage is simulated for a multi-material system with time-dependent saturated moisture concentrations. Different solubility activation energies and temperature conditions are considered. Numerical results demonstrate that the developed methodology can make accurate predictions under different conditions and it is more general than some other existing models which are limited to certain conditions.
Highlights
Polymer-based materials such as underfills, molding compounds, etc. are common materials used in microelectronic and optoelectronic components
Numerical results for the analysis of the desorption process in a bar during reflow soldering are presented by considering conventional thermal link and surface effect elements, diffusion (DF) and coupled field (CF) elements, and peridynamics
This study presents a new finite element-based modeling approach for moisture diffusion analysis
Summary
Polymer-based materials such as underfills, molding compounds, etc. are common materials used in microelectronic and optoelectronic components. If the saturated concentration is time-dependent, thermal-moisture analogy is no longer available For such cases, piecewise normalization and internal source approaches were developed [5,6]. Peridynamic theory (PD) [7,8] was utilized to determine moisture and wetness distribution in electronic packages for time-dependent saturated moisture concentration condition This technique is suitable for treating discontinuities and does not require an iterative solution. ANSYS, a commercially available finite element software, provides coupled field (CF) and diffusion (DF) elements for moisture diffusion analysis These elements are suitable for either time- or temperature-dependent saturated moisture concentrations. Various verification and demonstration studies are considered for multi-material systems having time-dependent saturated moisture concentrations, with different solubility activation energies and temperature conditions. For different solubility activation energies, there is a difference between the present results and those obtained using the ANSYS DF element
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