Abstract
Face nanogrinding was conducted on HgCdTe films using a novel ultrafine diamond wheel that we have developed. Damage-free subsurface was achieved after direct face nanogrinding. Two undeformed nanometer chips with rectangular cross-section were observed. The chip thickness varies from 25 to 28 nm, corresponding to a chip width/thickness ratio ranging from 3.2 to 3.4. A novel model of maximum undeformed chip thickness for face grinding was constructed, and the calculated results are consistent with those found experimentally.
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