Abstract
Abstract The resistance of a thick-film piezoresistor as a function of temperature has previously been shown to exhibit a parabolic characteristic. Through experimental research, a new model for this characteristic has been derived, which better explains the underlying mechanisms. The temperature characteristics of resistivity and resistance of z-plane thick-film resistors have been determined, and are shown to be exponential. The temperature characteristic of resistance of a conventional x-plane thick-film resistor is shown to result from a combination of this characteristic and a positive linear response. This linear response is due to the change in resistance caused by a strain resulting from the temperature coefficient of expansion mismatch between the resistor and substrate. These results will facilitate accurate temperature compensation of thick-film strain sensors, and further promote the adoption of a z-plane thick-film resistor as an ideal strain-sensor configuration.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
