Abstract
This paper discusses the parameters extraction and electrical characterization in high speed digital interconnection system using layer peeling algorithm and genetic algorithm. Base on the time domain reflection (TDR) measurement, the impedance profile of the device under test (D.U.T) is first derived by layer peeling transmission line synthesis. Then, the genetic algorithm (G.A.) is employed to extract the parameter of the lumped/distributed circuits in high-speed digital circuit. This algorithm is suitable for reconstructing the physically structures of a nonuniform couple transmission lines. The system characteristic can be obtained easily by the extracted model and SPICE circuit simulation software.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
