A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages

M X Yu

doi:10.1155/2016/9562854

Abstract

This paper investigates a novel X-band microstrip-to-microstrip vertical via transition with matching pads loaded signal via. This design has been proposed for a multilayer substrate package. The matching pads, which are located in the center of the signal via on each ground layer, are adopted to further improve the impedance matching level and thus attain better signal transition performance. A physics-based equivalent circuit modeling approach has been employed for this research. The right angle MS-to-MS via transition was also designed using this technique. The simulatedS-parameters indicate that the match-pad design made a breakthrough in achieving an approximate −15 dB wide-band return loss reduction. The measuredS-parameter of MS-to-MS transition showed that return loss with the matching pads is better than that without the matching pads.

Highlights

System-in-package (SiP) technology, based on the concept of integrating all of a system’s electronic components into a single package, is growing rapidly as a highly efficient solution to the increasing demand for cost-effective, compact, and reliable RF modules [1]
In order to improve the performance of RF packaging while reducing cost, minimizing dimensions, and simplifying the fabrication, the selective anodized aluminum substrate [7] and the multilayer printed circuit board (PCB) technology [8] has been adopted over the last few years
The configuration of the multilayer substrate package involved the four layered composite medium substrates and highly integrated transmit-receive (T/R) MMICs mounted on the top surface of the first layer and the bottom side of the last layer; this was in addition to the matching pads loaded through-hole via which connected the microstrip lines on the top layer to the bottom layer

Summary

Introduction

System-in-package (SiP) technology, based on the concept of integrating all of a system’s electronic components into a single package, is growing rapidly as a highly efficient solution to the increasing demand for cost-effective, compact, and reliable RF modules [1]. A multilayer package substrate is usually made of high temperature cofired ceramic (HTCC), low temperature cofired ceramic (LTCC), thick film, thin film, or organic packaging [2,3,4]. HTCC is regarded as the lowest cost ceramic technology, but it suffers from a significantly higher insertion loss. LTCC is the mainstream technology for three-dimensional packaging [5]. In order to improve the performance of RF packaging while reducing cost, minimizing dimensions, and simplifying the fabrication, the selective anodized aluminum substrate [7] and the multilayer printed circuit board (PCB) technology [8] has been adopted over the last few years

Methods

Results

Conclusion