A novel microchannel heat sink with staggered inlet and outlet to improve base surface temperature uniformity

Abstract

Non-uniform temperature distribution can lead to performance degradation and thermal failure of electronic devices. So as to improve the base surface temperature uniformity, we proposed a novel microchannel heat sink with staggered inlet and outlet. This arrangement divides a complete flow channel into three regions, and the flow direction in each channel can be changed to form different flow modes. The effects of flow mode, the inlet and outlet spacing, Reynolds number and channel length on the temperature uniform performance of base heating surface are investigated numerically. It is found that the microchannel heat sink with staggered inlet and outlet has more uniform fluid distribution and can ensure the same highest temperature in each region to improve the base surface temperature uniformity. The optimal spacing between middle inlet and outlet decreases as Reynolds number decreases for optimal flow mode, and the improving effect of temperature uniformity becomes worse with increasing channel length. Within the calculation parameter range, compared with the straight microchannel unit, the base temperature difference and the pumping power of staggered microchannel unit with countercurrent flow in each region are reduced by 77.6% to 81.3% and 56.1% to 68.8%, respectively.