Abstract
The high thermal conductivity and good insulating properties of boron nitride (BN) make it a promising filler for high-performance polymer-based thermal management materials. An easy way to prepare BN-polymer composites is to directly mix BN particles with polymer matrix. However, a high concentration of fillers usually leads to a huge reduction of mechanical strength and optical transmission. Here, we propose a novel method to prepare polyethylene/boron nitride nanoplates (PE/BNNPs) composites through the combination of electrostatic self-assembly and hot pressing. Through this method, the thermal conductivity of the PE/BNNPs composites reach 0.47 W/mK, which gets a 14.6% improvement compared to pure polyethylene film. Thanks to the tight bonding of polyethylene with BNNPs, the tensile strength of the composite film reaches 1.82 MPa, an increase of 173.58% compared to that of pure polyethylene film (0.66 MPa). The fracture stress was also highly enhanced, with an increase of 148.44% compared to pure polyethylene film. Moreover, the addition of BNNPs in PE does not highly reduce its good transmittance, which is preferred for thermal management in devices like light-emitting diodes. This work gives an insight into the preparation strategy of transparent and flexible thermal management materials with high thermal conductivity.
Highlights
Thermal management is essential to the performance and lifetime of modern electronic devices, such as chips, solar cells, and light-emitting diodes (LEDs), especially considering their fast miniaturization and integration
In the current work, we reported on a facile electrostatic self-assembly method to prepare PE/BNNPs composite film with improved thermal conductivity and dielectric properties, but without highly sacrificing the flexibility and transmittance of PE
The mixture of BNNPs and deionized water was stirred for 15–30 min to form a dense and homogeneous Langmuir film at the air-water interface
Summary
Thermal management is essential to the performance and lifetime of modern electronic devices, such as chips, solar cells, and light-emitting diodes (LEDs), especially considering their fast miniaturization and integration. With an extremely high transparency, polyethylene (PE) shows good chemical stability and insulation performance, which is very suitable for the thermal management of light-emitting diodes [3,4,5]. Pure PE film cannot meet the urgent heat dissipation requirement due to its low intrinsic thermal conductivity (below 0.4 W/mK) [6,7]. Novel technologies that can highly enhance the heat dissipation ability of transparent polymers like PE, yet still maintain its high flexibility and transmittance, are still in urgency
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