Abstract
In this study, we developed a new method to fabricate microcoils with narrow and high aspect ratio coil lines using TSV and UV-LIGA technology in a SU-8 mold. The combination of SU-8 and TSV makes it possible to fabricate microstructures with high aspect ratio. TSV technology resolved the difficulties of electroplating with high aspect ratio. We designed and fabricated microcoils consisiting of coil lines with widths of 15μm and aspect ratio of 2.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
