Abstract
With the miniaturization of portable products, integrate circuit becomes thinner, the effect of warpage on Package-on-Package (POP) stacking assemble on integrate circuit have become more distinct. It will lead to the deformation of the chip substrate and the more serious effectiveness of the solder joint. Consequently, in this paper, a novel method by adding fixed metal pillars in the middle of POP stacking substrates can well suppress warpage problems caused by the uneven heating reflow materials. Finally, this new method is feasible by analyzing the stress of warp model.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
