Abstract
The wire bonding of chips with copper interconnects is a challenging issue. The present study develops a method in which the substrates are stored in a temperature and humidity controlled environment such that copper oxide films of appropriate thickness are formed on the substrate prior to the gold-copper thermosonic bonding process. It is shown that this film can be removed during the bonding process, hence rendering the wire bonding process feasible without the requirement for an inert gas environment or the use of metallic cap layers.
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