Abstract
With the development of miniaturization and integration of electronic devices, the conventional manifold microchannels (MMCs) structure has been unable to meet the heat dissipation requirements caused by the rapid growth of internal heat flux. There is an urgent need to design a new heat dissipation structure with higher heat dissipation capacity to ensure the working stability and life of electronic devices. In this paper, we designed a novel manifold dual-microchannel (MDMC) cooling system that embedded the microchannel structure into the manifold microchannel structure. The MDMC not only has good heat dissipation performance that can meet the development needs of electronic equipment to miniaturization and integration, but also has a compact structure that does not increase the overall thickness and volume compared with MMC. The high temperature uniformity and heat transfer performance of MDMC are significantly improved compared to MMC. The Tmax is reduced by 13.6% and 17.5% at the heat flux density of 300 W/cm2 and 700 W/cm2, respectively. In addition, the influence of the inlet−2 velocity and the total microchannels number on the heat transfer performance of the MDMC structure are numerically investigated. The results show that the decrease rate of Tmax and ΔT is about 6.69% and 16% with the increase of inlet−2 velocity from 1.2 m/s to 2.4 m/s and microchannels number from 10 to 48, respectively. At the same time, the best temperature uniformity is obtained when the number of microchannels is 16.
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