Abstract
In this paper, embedded coaxial substrate integrated waveguide (CSIW) filters with innovative magnetic couplings are presented and studied. By creating the loading capacitance of a combline topology using inner layers of a low-temperature co-fired ceramic (LTCC) stack-up, it is possible to achieve resonator miniaturization while improving the spurious-free band and providing full-packaged solutions. Moreover, a new magnetic coupling scheme consisting of short-ended stripline probes is proposed and analyzed in detail, both for direct and external couplings. An in-line three-pole filter at L-band is designed, manufactured, and measured proving how the proposed approach can be used for designing wideband bandpass filter (BPF) with extremely compact size. The designed BPF is centered at 1.5 GHz with 10 % fractional bandwidth (FBW), while the layout size is just 35 × 9.5 mm 2 . The experimental results validate the coaxial SIW technology that allows for, at the same time, easy integration, compact size, flexible design, and enhanced stop-band performance.
Highlights
Substrate integrated waveguide (SIW) technology is considered to be a fruitful approach for the design and implementation of microwave and mm-wave components, such as cavity filters, antennas, directional couplers, oscillators, or power amplifiers among others [1]
The designed bandpass filter (BPF) is centered at 1.5 GHz with 10% fractional bandwidth (FBW), while the layout size is just 35 × 9.5 mm2
Moderate-to-high quality factor (Q), excellent planar integration, low weight, and low-cost manufacturing processes in printed circuit board (PCB) and low-temperature co-fired ceramic (LTCC) technology are some of the key advantages that can be obtained conveniently in substrate integrated waveguide (SIW) technology
Summary
Substrate integrated waveguide (SIW) technology is considered to be a fruitful approach for the design and implementation of microwave and mm-wave components, such as cavity filters, antennas, directional couplers, oscillators, or power amplifiers among others [1]. The combline topology, which can be modeled as a TEM-mode transmission line short-circuited at one end and terminated with a capacitor on the other, has been widely applied in waveguide and planar technologies for the compact implementation of high-order BPFs [2,3]. Such a scheme has been successfully introduced in SIW technology by using LTCC [4,5] and PCB [6]
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