Abstract
A novel low-temperature solder that consists entirely of two phases of intermetallic compounds has been developed as a reliable low-temperature interconnect. The new solder can be reflowed below 125°C and yet exhibits excellent mechanical properties at homologous temperatures exceeding 0.9. Specifically, the new solder exhibits creep resistance an order of magnitude greater than conventional low-temperature solders, and strength retention ability exceeding that of Sn-4%Ag-0.5%Cu (SAC405) at the same homologous temperatures.
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