Abstract
AbstractRapid advances in high power electronics packaging require the development of new heat sink materials. Advanced composites designed to provide thermal expansion control as well as improved thermal conductivity have the potential to provide benefits in the removal of excess heat from electronic devices. Carbon-carbon (C-C) composits are under consideration for several military and space electronic applications including SEM-E electronic boxes. The high cost of C-C composits has greatly hindered their wide spread commercialization. A new manufacturing process has been developed to produce high thermal conductivity (over 400 W/mK) C-C composites at greatly reduced cost (less than $50/lb). This new material has potential applications as both a heat sink and a substrate. Dielectric coatings such as A1N and diamond were applied to this new type of heat sink material. Processing, as well as mechanical and thermal properties of this new class of heat sink material will be presented.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
