A novel layout of the heat-sink base with a high cooling efficiency for polysilicon reduction furnace

Abstract

The performance of the heat dissipation system for polysilicon reduction furnaces could influence the crystal quality of polysilicon and the service life of electrodes. The heat-sink base of the polysilicon reduction furnace is a key cooling component because it is the foundation for the electrodes. This study presented a novel layout that slightly adjusted the layout of the inlet or outlet for the base and it could acquire a better cooling effect compared to the traditional layout. The influence of the location, size, and number of outlets has been a numerical study. The results showed that increasing the number of outlets and setting the inlet on the bottom could significantly improve the average temperature of the upper surface. The temperature decreased by 13% using the layout with two outlets and an inlet set on the bottom compared to the traditional layout. Reducing the size of the inlet also could further improve the cooling effect. However, reducing the size of the outlet has little influence on the cooling effect, but would greatly increase the internal pressure. This research could provide a novel layout for the design of the heat-sink base of polysilicon reduction furnaces.