A novel Intelligent Power Module (IPM) in a compact transfer Mold package with New High Voltage Integrated Circuit (HVIC) and integrated bootstrap diodes

Abstract

Transfer Mold IPM employs a novel insulated thermal sheet technology and Full-Gate CSTBT™ ranging from 5A to 15A with blocking voltage of 600V. The complete protection functions and the novel HVIC and bootstrap diode being integrated into the package structure create a state-of-the-art IPM which can be evaluated easily by the described evaluation platform.