Abstract
A flip-chip interconnection technique using small solder bumps instead of conventional wire bonding for high-speed broadband photoreceivers is described. The technique achieves interconnection with low parasitic elements, no damage to devices, and easy assembly. A photoreceiver composed of a broadband p-i-n photodiode and a laser-speed GaAS metal-semiconductor field-effect transistor (MESFET) preamplifier connected using solder bumps that are about 26 mu m in diameter, with a frequency response of over 22 GHz at 1.55 mu m, is demonstrated. This confirms the effectiveness of the solder bump interconnection technique for future high-speed broadband optical modules.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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