Abstract
A new single wafer process with a unique integration of bulk and surface micromachining process steps has been designed, developed, and demonstrated for MOEMS/MEMS devices, which require large free space for structural movements. 3D free space electrostatic micromirror device was used as the test vehicle for this development. Bottom electrode, flexure springs, and micromirror plate were fabricated in single crystal silicon substrate layer, while the top electrode plate and bending springs were realized in polycrystalline silicon layers. The realized test chip 3D micromirror devices were tested and an angular deflection of up to 2° was measured.
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