Abstract

Infrared analysis is a well-established tool for measuring composition and purity of various materials in industrial-, medical- and environmental applications. Traditional spectrometers, for example Fourier Transform Infrared (FTIR) Instruments are mainly designed for laboratory use and are generally, too large, heavy, costly and delicate to handle for remote applications. With important advances in the miniaturization, ruggedness and cost efficiency we have designed and created a new type of a micromirror spectrometer that can operate in harsh temperature and vibrating environments This device is ideally suited for environmental monitoring, chemical and biological applications as well as detection of biological warfare agents and sensing in important security locations In order to realize such compact, portable and field-deployable spectrometers we have applied MOEMS technology. Thus our novel dual detector micro mirror system is composed of a scanning micro mirror combined with a diffraction grating and other essential optical components in order to miniaturize the basic modular set-up. Especially it periodically disperses polychromatic radiation into its spectral components, which are measured by a combination of a visible (VIS) and near infrared (NIR) single element detector. By means of integrated preamplifiers high-precise measurements over a wide dynamic wavelength range are possible. In addition the spectrometer, including the radiation source, detectors and electronics can be coupled to a minimum-volume liquid or gas-flow cell. Furthermore a SMA connector as a fiber optical input allows easy attachment of fiber based probes. By utilizing rapid prototyping techniques, where all components are directly integrated, the micro mirror spectrometer is manufactured for the 700-1700 nm spectral range. In this work the advanced optical design and integration of the electronic interface will be reviewed. Furthermore we will demonstrate the performance of the system and present characteristic measurement results. Finally advanced packaging issues and test results of the device will be discussed.

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