Abstract
AbstractThe Deal–Grove model is a state‐of‐the‐art approach proposed for describing the thermal oxidation of silicon and the oxide thickness over time. In this study, the Deal–Grove concept provided the inspiration for a mathematical model for simulating plasma jet‐based dry etching process of borosilicate crown glass (N‐BK7®). The whole process is contained in two so‐called Deal–Grove parameters, which are extracted from experimental data including local etching depth and surface temperature distribution. The proposed model is extended for the evolution of dynamic etch profiles, and the obtained results are validated experimentally. By establishing such a model, it is possible to predict the effect of the residual layer and surface temperature on the evolution of local etching depths over dwell time.
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