Abstract
Through-wafer electrical interconnection is a critical technology for advanced packaging. In this paper, a novel capillary-effect-based solder pump has been proposed and analyzed, which could produce interconnects through and between silicon dies. The principle of this pump is to use the surface tension of a molten solder, introduced in the form of balls, to drive sufficient material into a deep reactive-ion etched hole to form a through-wafer conductive path. The solder pump structure uses unwettable through-wafer holes of different diameters together with wettable metallization on two dies to provide the pressure differential and flow path. Using multiple feed holes and a single via hole complete through-wafer interconnects are demonstrated.
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