A novel assembly technology of aluminum alloy honeycomb structure

Abstract

In this study, the authors applied the low-temperature ultrasonic soldering method to solder aluminum alloy honeycomb structure and investigated the effects of soldering time and soldering temperature on the properties of the solder. The following results were obtained: The wetting angle changed with applied time and applied temperature. The solder region is mainly composed of four kinds of microstructure zones: rich Sn zone, rich Pb zone, Sn–Pb eutectic phase, and rich Al zone. Microanalysis identified a continuous reaction product at the alumina–solder interface as a rich Pb zone. The wet angle data had significantly greater variability, with values ranging from 10° to 90°. The highest value was obtained for the samples soldered with Sn–Pb–Zn alloy for 30 s. Fractures occurred along the solder–alumina interface for the 6061 aluminum alloy. Fracture surface included hybrid tough fracture of dimple and tear ridge. The interface could firstly strip at the rich Bi zone with the effect of shear stress.