Abstract
A novel technique for the deposition of piezoelectric thin films is presented. By applying the benefits of DC magnetron sputtering and radio frequency plasma enhanced chemical vapor deposition, a new technique denoted direct current biased radio frequency plasma enhanced chemical vapor deposition, or DCB-RFPECVD, has been developed. A DC bias was placed on the RF plasma; the bias voltage was much greater than typically used in RF PECVD. The high deposition rate and uniformity associated with RF PECVD are maintained in this process, and an enhanced crystallographic orientation to the thin film can be obtained.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.