Abstract
This paper presents a new method of joint disassembly using a liquid metal. Liquid gallium was used as a release material to separate an interface joined metallurgically. The surface activated bonding method was used to create a strait interface for penetration path of gallium. This separation method was successfully demonstrated in the case of the joint parts of aluminum-aluminum, aluminum-sapphire, aluminum thin film wire-gold bump and soldered chip on the printed circuit board. The joints were separated easily by penetration of gallium atoms. The surface bonding method was an effective bonding method for separation using liquid gallium
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