Abstract
A novel approach to chip-to-chip communication for RSFQ technology is proposed. The main idea is to fabricate Josephson junctions on a substrate for multi-chip packaging, which equips the substrate as well as the chip with built-in active drivers and receivers. The driver on the chip is connected directly to the receiver on the substrate through a connector which can be considered as a lumped circuit element. Because the circuit is free from the impedance matching constraint, broadband chip-to-chip data transfer with wide operating margins will be realized. We have designed, simulated and optimized a chip-to-chip single flux quantum (SFQ) pulse transfer circuit. For a connector inductance of 20 pH, the bias current margins and the maximum throughput have been calculated to be /spl plusmn/24% and above 50 Gb/s, respectively.
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