Abstract
In this work, a novel test structure design is proposed for the characterization of sodium (Na) contaminants during anodic bonding. The new structure can be described as a sheet-resistivity process control monitor (PCM) based on P-type piezoresistor with electrical connection that enables direct measurement after bonding process. This design avoids external contamination through mechanically opening the structure as in some previous research, and, thus, ensures a reliable result. Additionally, the test structure is paired with a twin structure, which functions as a local reference by shielding the resistor with metallization to minimize the effect of process deviation. The designed structure was fabricated at Infineon Technologies AG and anodically bonded inside an environment with a steady Na distribution while nitrogen filling profile is controlled to characterize the influence of gas flow on Na contamination. After the bonding process, a wafer-level probing was carried out, which gave a direct result that shows the relationship between measurement deviation and gas filling parameters.
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