A Novel Approach for Characterizing Epoxy Mold Compound High Temperature Swelling

Abstract

In this paper, a novel method for measuring hightemperature material swelling of an epoxy mold compound is explored. This work attempts to extend the swelling characterization beyond the capability of typical commercial tools. The approach uses a high-pressure chamber to maintain a saturated liquid environment for the specimen. Digital image correlation is used to measure in-situ strain change in the specimen due to hygro-thermal expansion. The results show moisture-induced swelling increases with temperature and is significant compared with thermal expansion. Results are compared against other measurement methods and published data. This has yielded good fundamental learnings for the novel concept and identified areas for future work.