Abstract
In this paper, a novel 3D planar inverted-L antenna (PILA) Ultrahigh Frequency (UHF) Radio Frequency Identification (RFID) tag mountable on metallic surfaces is proposed for the Internet of Things (IoT) indoor localization applications. The proposed tag antenna (45 mm × 82 mm × 4 mm or 0.137λ × 0.25λ × 0.012λ) is designed for mounting on metallic objects. The 3D PILA antenna is fabricated using a copper sheet of thickness 1 mm and air as the dielectric substrate in order to minimize costs for materials and realization. In the design, T-slot has been inserted in the radiating element for tuning of the tag’s resonance for achieving good matching with the chip. Also, a simple equivalent circuit model has been obtained to analyze the impedance of the 3D PILA. Based on the optimized design, the fabricated prototype has been measured in the anechoic chamber. The resonant frequency of the proposed tag is stable, and it is not affected much by the metallic object. The measurement results of the antenna prototype demonstrated a reasonable agreement with the simulation results, and a read range of 3.6 m was measured inside an anechoic chamber. Most importantly, in the building hallway, the proposed tag is able to achieve a maximum read distance of 18 m with a transmitted power of 31.5 dBm at 867 MHz when placed on metal. With the 3D PILA antenna structure, the proposed antimetal tag is a suitable solution that can be integrated into an indoor localization scenario.
Highlights
Indoor localization systems have attracted research interest during the last decade due to their various application [1]
A new type of L-shaped antenna is used for designing a novel 3D tag antenna that can be mounted on a metal object for IoT Radio Frequency Identification (RFID) applications. e proposed 3D planar inverted-L antenna (PILA) tag without substrate does not require the use of vias to achieve the antenna design, which reduces the cost of the manufacturing process. is paper is organized in the following way: in Section 2, the antenna configuration is explained and an equivalent circuit is developed to describe the input impedance of the proposed 3D PILA
Results and Discussion e proposed 3D PILA tag is placed on the center of a piece of 300 × 300 mm2 metallic plate in simulations and measurements
Summary
Indoor localization systems have attracted research interest during the last decade due to their various application [1]. Applications of the AMC and EBG structures can help improve the gain and the read range, but they introduce higher fabrication costs and increase the tag size. To further reduce the patch antenna size, the folding method has recently been proposed for designing various flexible RFID tags for on-metal applications [12,13,14,15]. E planar inverted-F antenna (PIFA) using the metallic surface as ground plane is a popular structure for designing miniature metal tags. A new type of L-shaped antenna is used for designing a novel 3D tag antenna that can be mounted on a metal object for IoT RFID applications. E proposed 3D PILA tag without substrate does not require the use of vias to achieve the antenna design, which reduces the cost of the manufacturing process.
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