A novel 3D detector configuration enabling high quantum efficiency, low crosstalk, and low output capacitance

Abstract

The benefits of pixelated planar direct conversion semiconductor radiation detectors comprising a thick fully depleted substrate are that they offer low crosstalk, small output capacitance, and that the planar configuration simplifies manufacturing. In order to provide high quantum efficiency for high energy X-rays and Gamma-rays such a radiation detector should be as thick as possible. The maximum thickness and thus the maximum quantum efficiency has been limited by the substrate doping concentration: the lower the substrate doping the thicker the detector can be before reaching the semiconductor material's electric breakdown field. Thick direct conversion semiconductor detectors comprising vertical three-dimensional electrodes protruding through the substrate have been previously proposed by Sherwood Parker in order to promote rapid detection of radiation. An additional advantage of these detectors is that their thickness is not limited by the substrate doping, i.e., the size of the maximum electric field value in the detector does not depend on detector thickness. However, the thicker the substrate of such three dimensional detectors is the larger the output capacitance is and thus the larger the output noise is. In the novel direct conversion pixelated radiation detector utilizing a novel three dimensional semiconductor architecture, which is proposed in this work, the detector thickness is not limited by the substrate doping and the output capacitance is small and does not depend on the detector thickness. In addition, by incorporating an additional node to the novel three-dimensional semiconductor architecture it can be utilized as a high voltage transistor that can deliver current across high voltages. Furthermore, it is possible to connect a voltage difference of any size to the proposed novel three dimensional semiconductor architecture provided that it is thick enough—this is a novel feature that has not been previously possible for semiconductor components. Yet another feature of the novel three dimensional semiconductor architecture is that despite the thick substrate it can also be efficiently cooled.