Abstract
Insulated Metal Substrates (IMS) have been used in the automotive industry for a number of years. The popularity of this technology is due to the good thermal conductivity of the thin insulation material, which is more effective than convection cooling, and the high temperature performance of the adhesive used for under‐bonnet applications. This paper describes how IMS circuits can be designed and manufactured with two or more layers without using the traditional plating processes.
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