Abstract
A new CPU cooling-fluid technology for CPU chip cooling by means of concentrated suspension flows of non-colloidal particles is introduced, and investigated through theory, complex CFD modeling and simulation. A new CPU cooling device is developed and presented in this purpose. Upon imposing a constant heat flux on one surface of the device, representing the thermal design power (TDP) of a CPU chip, for the first time, we shed the light on suspension flows of rigid non-colloidal particles that may overcome other classical fluids (i.e. water, nanofluids) which are usually applied in the cooling of CPU units under forced-convection flow regimes. An advantage of non-colloidal particles over its nanofluids counterpart lies in the fact that non-colloidal rigid particles of diameter dp>10μm are human health and environmentally friendly. Three different types of CPU cooling-fluids are examined and compared: a pure water flow at Re=2000 (kf=0.6Wm-1K-1;ρf=1000kgm-3), and two concentrated isodense suspension flows at ReS=294 (ϕ=0.35 as volume fraction of particles of diameter dp=50μm) that have the following physical properties, respectively: kp=kf, and kp=100kf with ρp=ρf.
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