A new strategy to reduce edge chipping using stress wave impedance matching

Abstract

To restrain edge chipping and elucidate its mechanism during machining, the initiation of edge chipping was investigated in this study from the propagation properties of stress waves in the fractured media. Three technological principles of the support for chipping suppression were proposed to reduce the intensity of reflected extension waves, namely, the wave impedance matching, the smaller residual gap and the higher viscosity of the gap filler between the workpiece and the support. As demonstrated from the experimental results, using brass support with non-solid epoxy gap filler can significantly restrain the edge chipping of pressureless sintered silicon carbide during grinding.