Abstract

This paper presents TH-CSF3, a reliability prediction model for plastic encapsulated integrated circuits used in rugged environment or military electronics applications. First part is an analysis of diffierent reliability prediction models: their hypotheses, assumptions. validity domains are examined; constructive criticism is made and model amendments are proposed for plastic encapsulated ICs reliability prediction. Second part presents the model itself and the methodology used to built it. It addresses how physical parameters which have in influence on the predicted reliability are inuoduced. Third part is a presentation of first calculations made with do model. In conclusion, we present the improvments that this model can bring to reliability calculation methods, in particular for plastic packages.

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