A new predicting model study on U-shaped stamping springback behavior subjected to steady-state temperature field

Abstract

Springback is the main defect in the U-shaped stamping process, which affects the forming accuracy and shape of parts, and one of the main reasons is that the temperature of materials affects the stress distribution during deformation. This paper establishes a U-shaped predicting model considering one-dimensional temperature field, deformation of bending and anti-bending as well as anisotropy of material to study the influence of temperature field on stress distribution. This theoretical model studies thermodynamic behavior of aluminum material during sheet formability and springback process, such as the variation of sheet thickness, the relative offset of neutral layer and so on. The theoretical calculating model and finite element analysis model of U-shaped stamping parts are established by using Mathematica software and ABAQUS software, and the calculating results are compared by the case 1 so as to verify the accuracy of present work.