Abstract
We show how it is possible to study the atomic diffusion along high conductivity paths in the surface region by using Ultraviolet Photoelectron Spectroscopy; the new approach allows to work in conditions in which there is no interference from other diffusion processes in the bulk. We have studied Cu diffusion along dislocations and grain boundaries in a polycrystalline Cd sample by depositing Cu onto Cd and by measuring the intensity of the Cu 3d photoemission peak vs time at selected increasing temperatures. We show how to derive the activation energy which results (0,65±0,06) eV. We discuss the advantages of this method.
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