Abstract
The solder ball shear test is a commonly used method to evaluate the attachment strength of solder balls. However, some previous studies indicated that the solder ball shear test may not be suitable for showing the effect of intermetallic compound (IMC) growth due to thermal aging. This is because the IMC layer is thin and not susceptible to the shear loading. Since the IMC layer consists of brittle materials, the ball pull test should be a better method to evaluate the solder ball attachment strength. The major challenge of conducting a solder ball pull test is how to grip the solder ball. This paper presents an innovative method for conducting the solder ball pull test. A shape memory alloy (SMA) tube is used to grip the solder ball and pull it off from the substrate. The inner diameter of the SMA tube is originally smaller than the diameter of the solder ball under testing. Once the temperature is raised to higher than the switching temperature of SMA, the SMA tube will expand radially, resulting an inner diameter larger than the solder ball. After the SMA tube cools down, the tube contracts and grips the solder ball firmly. The solder ball can then be pulled off from the attached substrate by frictional force. A prototype of the aforementioned solder ball pull test device has been developed. Some preliminary testing results are presented in this paper.
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